LandOffer
Thin Films Module Development Engineer
Job details
- Pay
- $155,520 – $255,200 a year
- Work mode
- On-site
- Employment
- Full-time
- Level
- Senior
- Experience
- 6+ years
- Education
- Bachelor's degree
- Posted
- Oct 30, 2026
- Last confirmed open
- Oct 31, 2026
What you'll need to apply
Fields this application requires
Company-specific questions
- 1) * As of today's date, are you 18 years of age or older?
- 2) * Are you a current or former employee of Ernst & Young?
- 3) * Are you an immediate family member (parent, child, sibling, spouse/partner) of a partner at Ernst & Young who is based out of the San Jose, California office?
- 4) * To the best of your knowledge and belief, are you aware of a contract or agreement with your current employer (or other company), such as a non-competition, non-disclosure, or non-solicitation agreement, that impact or interfere with your ability to work for the Company or communicate with former colleagues about working at the Company
- 5) * Do you own, control, or have an economic interest in any intellectual property rights (patents, trademarks, or copyrights)?
- 6) * If hired, do you intend to (select all that apply):
- 7) * Are you a current employee of the US Department of Defense (DOD) or were you an employee of the US Department of Defense (DOD) on or after January 28, 2008?
- 8) * Are you a current Federal, State or Local Government employee; including military (other than the DOD) or have you at any time in the past 5 years been an employee of one of these entities?
- 11) * Do you now, or in the future, require Intel to sponsor you for a visa to work in the United States? NOTE: Individuals with work authorization issued pursuant to their student visa ( e.g., F-1, J-1, M-1 ) or currently on work visas specific to their current employer ( e.g., H-1B, O-1, TN, H-1B1, E-3 ), should answer “Yes” because Intel must file a visa petition on your behalf now or in the future. Intel immigration sponsorship refers to Intel filing employment-based visa and permanent resident applications on behalf of the employee in order for the individual to have the legal right to work in the U.S. Individuals with work authorization not dependent on Intel sponsorship should respond “No”, e.g., Family based immigration, DACA, TPS, PIP, & Asylum Applicant.
About this role
Job Details
Job Description:
Intel Foundry is seeking experienced Thin Films Metals Module Development Engineers to join the Technology Development organization. The role will be defined by developing and delivering metals modules for advanced semiconductor technologies, leveraging a combination of in-depth hardware knowledge and process expertise to deliver modules that fulfill program process needs within the hardware capabilities.
This is a hands-on technical role for results-oriented engineers who can formulate concise technical problem statements, establish a roadmap and timeline, lead with data and partner with stakeholders to deliver on-time results.
Qualifications
- Minimum qualifications are required to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- Bachelor's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 6+ years of experience
OR
- Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 4+ years of experience
OR
- Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 2+ years of experience
Experience in semiconductor manufacturing or process development includes one or more of the following:
- Expertise in process optimization, defect reduction, and manufacturing process improvements for advanced technology nodes
- Proficiency in Design of Experiments (DOE), Statistical Process Control (SPC), and structured problem-solving methodologies
- Hands-on expertise in dry etch processes, material science, and equipment metrology
- Technical experience with semiconductor manufacturing equipment and collaboration with suppliers to optimize hardware and materials
Preferred Qualifications:
- Doctoral degree in a relevant engineering or science field
- Experience with sub-10nm technology nodes and advanced device architectures like FinFET or Gate-All-Around (GAA)
- Proven record of delivering process solutions in Technology Development (TD) and High Volume Manufacturing (HVM)
- Cross-functional leadership experience for yield improvement, defect reduction, or technology ramp initiatives
- Experience mentoring engineers and providing technical guidance
- Strong ownership mindset with the ability to lead initiatives from concept through implementation
For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .
Annual Salary Range for jobs which could be performed in the US: $155,520.00-255,200.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment.
If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.