Low Power Analog-Mixed Signal Technologist, Senior Director

Company:

Qualcomm Technologies, Inc.

Job Area

Engineering Group, Engineering Group > ASICS Engineering

General Summary:

The Senior Director of Low Power Analog & Mixed-Signal Technologist will serve as the key technology and organizational leader responsible for defining and executing the long-term strategy for advanced sensing, mixed-signal semiconductor platforms, and intelligent edge systems.

This leader will drive innovation and product differentiation across Robotics, Extended Reality (XR), Industrial IoT (IIoT), Intelligent Sensors, and AI-enabled embedded platforms.

The role requires a unique combination of deep technical expertise, executive leadership, business acumen, and cross-functional influence. The successful candidate will work with multiple engineering organizations and senior technical leaders while shaping technology roadmaps, investment priorities, ecosystem partnerships, and multi-generation platform strategies.

This position will play a critical role in developing technologies for next-generation sensor ASIC IP, mixed-signal subsystems, intelligent sensing architectures, and edge AI platforms, while ensuring alignment between technical execution, customer requirements, and business objectives.

Qualifications

• Ph.D. in Electrical Engineering, Computer Engineering, or related discipline with 10+ years of relevant industry experience

OR

• M.S. in Electrical Engineering, Computer Engineering, or related discipline with 14+ years of relevant industry experience

Additionally:

• Proven experience leading large engineering organizations consisting of directors, managers, architects, and senior technical contributors.
• Extensive expertise in low-power analog, mixed-signal, sensor, and semiconductor system architecture.
• Demonstrated success defining and delivering complex semiconductor products from concept to high-volume production.
• Experience leading global cross-functional teams spanning silicon development (pre/post bringup), firmware, software, validation, packaging, manufacturing, and product engineering.
• Strong track record of driving technology strategy, technical innovation, and organizational transformation.
• Experience managing external partners, technology suppliers, foundries, IP providers, and strategic ecosystem relationships.
• Demonstrated ability to influence executive leadership and business stakeholders through technology vision and execution excellence.

Leadership and Technical Responsibilities

Technology Strategy and Vision

• Define and own the long-term technology roadmap for low-power analog, mixed-signal, sensing, and intelligent edge computing platforms.
• Drive technology planning for Robotics, XR, Industrial Automation, Intelligent Sensors, and Edge AI applications.

Organizational Leadership

• Build a high-performance engineering culture focused on innovation, execution excellence, technical rigor, and continuous learning.
• Foster collaboration across global cross-functional engineering organizations and external technology partners.
• Drive engineering process improvements, quality initiatives, and operational excellence across the organization.
• Mentor senior technical teams across systems engineering, platform integration, and architecture execution.

Technical Leadership

• Provide executive oversight of system architecture across sensing, mixed-signal ICs, AI processing, embedded software, communication interfaces, packaging, and system integration.
• Guide architecture tradeoffs involving power, performance, scalability, latency, reliability, safety, security, and cost.
• Lead technology review boards and critical architecture decision forums.
• Drive development of platform architectures that enable reusable technologies across multiple product families and business segments.
• Champion innovation through patents, publications, strategic research initiatives, and industry engagement.

Ecosystem and Industry Leadership

• Build strategic relationships with customers, suppliers, foundries, technology partners, universities, and research organizations.
• Drive external collaborations that accelerate innovation and product differentiation.

Principal Duties and Responsibilities

Program Leadership

• Oversee a portfolio of mixed-signal, sensor, and intelligent edge technology programs spanning multiple product generations.
• Align technology roadmaps with business requirements, customer needs, and market opportunities.
• Establish execution frameworks, milestones, and risk mitigation plans for key development programs.
• Ensure successful program delivery from concept initiation through commercialization and production ramp.

Advanced Semiconductor Platform Development

• Direct development of advanced mixed-signal technologies such as Analog Front Ends (AFEs), ADCs and DACs, Low-Power Sensor Interfaces, Timing and Synch/Asynch Architectures, Power Management IP, Sensor Fusion Platforms, Intelligent Edge Processing Architectures, AI-Enabled Sensor Systems.
• Guide architecture and implementation decisions involving CMOS technologies, heterogeneous integration, advanced packaging, chiplets, and system-in-package solutions.
• Ensure product reliability, manufacturability, yield optimization, and cost effectiveness throughout the development lifecycle.

Robotics and Intelligent Sensing Leadership

• Define technology strategies for tactile sensing, multi-modal sensing, robot perception, autonomous systems, and intelligent control platforms.
• Drive integration of advanced sensor technologies with AI, machine learning, and robotics software frameworks.
• Establish scalable platform strategies that support multiple generations of robotics and intelligent edge products.
• Enable differentiation through innovative sensing architectures and intelligent processing solutions and new sensing device designs in collaboration with process tech team.

Business Impact and Execution

• Influence product strategy, commercialization plans, customer engagements, and investment priorities.
• Drive measurable business outcomes through technology leadership and execution excellence.

Minimum Qualifications

• Bachelor's degree in Science, Engineering, or related field and 10+ years of ASIC design, verification, validation, integration, or related work experience.

OR

Master's degree in Science, Engineering, or related field and 9+ years of ASIC design, verification, validation, integration, or related work experience.

OR

PhD in Science, Engineering, or related field and 8+ years of ASIC design, verification, validation, integration, or related work experience.

Preferred Qualifications

• PhD Degree in Engineering, Information Systems, Computer Science or related field.
• 15+ years of ASIC design and Systems Engineering or related work experience.
• 15+ years of analog mixed signal domain expertise with low power designs.
• 4+ years of experience working in a large matrixed organization.
• 4+ years of supervisory experience.
• 3+ years of work experience in a role requiring interaction with executive leadership (e.g., Vice President level and above).
• 2+ years of working with operating budgets and/or project financials.
• Experience leading semiconductor or system organizations focused on Robotics, XR, Industrial Automation, AI, or Intelligent Edge Computing.
• Deep understanding of edge AI architectures, sensor fusion algorithms, machine learning systems, and autonomous platforms.
• Knowledge of functional safety, reliability engineering, cybersecurity, and mission-critical embedded systems.
• Experience leading development of custom ASICs, sensor platforms, SoCs, or large-scale semiconductor portfolios.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [email protected] or call Qual