LandOffer
Substrate Supplier Enablement Engineer
Job details
- Work mode
- On-site
- Employment
- Full-time
- Level
- Entry level
- Experience
- 2+ years
- Education
- Bachelor's degree
- Posted
- Sep 10, 2026
- Last confirmed open
- Oct 29, 2026
What you'll need to apply
Fields this application requires
Company-specific questions
- 1) * As of today's date, are you 18 years of age or older?
- 2) * Are you a current or former employee of Ernst & Young?
- 3) * Are you an immediate family member (parent, child, sibling, spouse/partner) of a partner at Ernst & Young who is based out of the San Jose, California office?
- 4) * To the best of your knowledge and belief, are you aware of a contract or agreement with your current employer (or other company), such as a non-competition, non-disclosure, or non-solicitation agreement, that impact or interfere with your ability to work for the Company or communicate with former colleagues about working at the Company
- 5) * Do you own, control, or have an economic interest in any intellectual property rights (patents, trademarks, or copyrights)?
- 6) * If hired, do you intend to (select all that apply):
- 7) * Are you a current employee of the US Department of Defense (DOD) or were you an employee of the US Department of Defense (DOD) on or after January 28, 2008?
- 8) * Are you a current Federal, State or Local Government employee; including military (other than the DOD) or have you at any time in the past 5 years been an employee of one of these entities?
- 11) * Do you now, or in the future, require Intel to sponsor you for a visa to work in the United States? NOTE: Individuals with work authorization issued pursuant to their student visa ( e.g., F-1, J-1, M-1 ) or currently on work visas specific to their current employer ( e.g., H-1B, O-1, TN, H-1B1, E-3 ), should answer “Yes” because Intel must file a visa petition on your behalf now or in the future. Intel immigration sponsorship refers to Intel filing employment-based visa and permanent resident applications on behalf of the employee in order for the individual to have the legal right to work in the U.S. Individuals with work authorization not dependent on Intel sponsorship should respond “No”, e.g., Family based immigration, DACA, TPS, PIP, & Asylum Applicant.
About this role
Job Details
Job Description:
The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology Integration Group, you will play a critical role in enabling new manufacturing capacity across advanced packaging suppliers.
In this position, you will lead substrate supplier development and qualification activities for advanced technologies such as high density FCBGA, EMIB-T and glass core substrate, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams and supplier partners.
Please note
This role requires periodic meetings with suppliers in East Asia and stakeholder in US, as well as occasional trip to supplier sites to support essential program objectives.
Responsibilities
- Collaborate with suppliers and internal engineering teams to develop robust building block processes across component embedding, core fabrication, laser drilling, dielectric lamination, lithography, electrolytic multi metal plating, defect inspection/metrology, electrical testing, and other substrate technologies.
- Partner closely with onsite supplier engineering teams and the APTD Substrate Integration team to advance substrate building block technologies and manage critical process interactions.
- Ensure suppliers meet all Product Control System (PCS) commitments with rigor and consistency.
- Work with cross functional teams to design and implement new factory technology validation and product certification plans focused on yield improvement.
- Develop and maintain detailed micro schedules for new factory startup activities, including key milestones, to ensure supplier alignment with startup timelines.
- Lead qualification activities and monitor ramp indicators to enable an incident free production ramp and successful introduction of new capacity.
Qualifications
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- Bachelor's degree with 6+ years of experience, OR Master's degree with 4+ years of experience, OR PhD with 2+ years of experience in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related technical field.
Experience listed above should be a combination of the following:
- Statistical tools and methods, including Statistical Process Control (SPC) for yield improvement.
- Experience managing complex projects and deliver results in high-volume manufacturing environments.
- Experience with packaging, substrates, or semiconductor manufacturing.
- Experience with process flow development, FMEA, DOE design, and/or problem-solving tools.
Preferred Qualifications
- Proven leadership in supplier management or technology enablement; and the ability to drive alignment and execution across global teams
- Proven ability to thrive in high-ambiguity environments and deliver results under pressure. Knowledge of advanced packaging technologies and substrate/assembly manufacturing methodologies.
Job Type
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .
Annual Salary Range for jobs which could be performed in the US: $120,860.00-198,820.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment.
If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.