Senior Member of Technical Staff, Thin Films Engineer
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Company-specific questions
- 1) * As of today's date, are you 18 years of age or older?
- 2) * Are you a current or former employee of Ernst & Young?
- 3) * Are you an immediate family member (parent, child, sibling, spouse/partner) of a partner at Ernst & Young who is based out of the San Jose, California office?
- 4) * To the best of your knowledge and belief, are you aware of a contract or agreement with your current employer (or other company), such as a non-competition, non-disclosure, or non-solicitation agreement, that impact or interfere with your ability to work for the Company or communicate with former colleagues about working at the Company
- 5) * Do you own, control, or have an economic interest in any intellectual property rights (patents, trademarks, or copyrights)?
- 6) * If hired, do you intend to (select all that apply):
- 7) * Are you a current employee of the US Department of Defense (DOD) or were you an employee of the US Department of Defense (DOD) on or after January 28, 2008?
- 8) * Are you a current Federal, State or Local Government employee; including military (other than the DOD) or have you at any time in the past 5 years been an employee of one of these entities?
- 11) * Do you now, or in the future, require Intel to sponsor you for a visa to work in the United States? NOTE: Individuals with work authorization issued pursuant to their student visa ( e.g., F-1, J-1, M-1 ) or currently on work visas specific to their current employer ( e.g., H-1B, O-1, TN, H-1B1, E-3 ), should answer “Yes” because Intel must file a visa petition on your behalf now or in the future. Intel immigration sponsorship refers to Intel filing employment-based visa and permanent resident applications on behalf of the employee in order for the individual to have the legal right to work in the U.S. Individuals with work authorization not dependent on Intel sponsorship should respond “No”, e.g., Family based immigration, DACA, TPS, PIP, & Asylum Applicant.
About this role
Employer-provided description, formatted for easier reading.
Job Details
Job Description:
Organization Overview: Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM).
We bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), advancing technology nodes and process capability from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers.
About This Role
Join Intel's Manufacturing Development and Customer Engineering (MDCE) team as a senior technical leader driving process innovation across Intel's most advanced semiconductor technologies in volume manufacturing.
You will spearhead the development, optimization, and manufacturability of critical thin film deposition processes, ensuring seamless transitions from early development to high-volume production while meeting Intel foundry customer requirements.
Your Mission
Lead thin film process excellence across CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal, and/or treatment technologies. Operating at the nexus of Technology Development and High-Volume Manufacturing, you will drive breakthrough solutions for Intel 18A, Intel 3, 12nm, and next-generation technology nodes.
Key Responsibilities
Process Innovation and Excellence
- Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules
- Drive defectivity reduction and uniformity improvements through systematic process enhancement
- Lead technical problem resolution and deliver solutions that meet aggressive technology node targets
- Optimize equipment performance working with internal teams and key suppliers
Strategic Technical Leadership
- Align technical vision with customer requirements and business objectives
- Synthesize complex technical data to formulate and execute strategic responses
- Own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines
- Deliver rapid execution of innovative solutions to meet challenging development timelines
Cross-Functional Partnership
- Collaborate closely with Technology Development, High Volume Manufacturing, and Business Groups
- Build strong relationships with Integration, Device, Yield, Quality, Reliability teams, and external suppliers
- Present technical findings effectively to diverse audiences from engineering teams to executive leadership
- Foster in-person collaboration to accelerate decision-making and problem resolution
Industry Leadership
- Stay current with semiconductor industry trends and emerging process technologies
- Drive strategic initiatives that position Intel at the forefront of manufacturing innovation
- Contribute to technology roadmaps through hands-on technical expertise and market insight
What We're Looking For
Technical Excellence
- Results-driven professional with exceptional technical problem-solving abilities
- Proven track record of significant accomplishments across multiple technology nodes
- Strong analytical skills with expertise in yield improvement, performance enhancement, and variation reduction
- Deep understanding of semiconductor manufacturing strategies, fab operations, and technology transfer
Leadership Capabilities
- Outstanding communication skills for presenting complex technical information to varied audiences
- Self-motivated with strong initiative and ability to navigate ambiguous technical challenges
- Demonstrated ability to manage multiple high-priority projects under pressure while maintaining quality focus
- Experience driving clarity in complex technical situations and leading cross-functional initiatives
Industry Expertise
- Comprehensive knowledge of process development, materials science, and device physics
- Ability to interpret industry trends and translate market dynamics into actionable technical strategies
- Experience with foundry business models and customer engagement requirements
- Proven capability to work independently while managing diverse technical assignments
Qualifications:
The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through industry-related job experience. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field
- 5+ years semiconductor industry experience with strong focus on thin film deposition processes
- Proven experience in process development, technical leadership, and manufacturing engineering
- Experience working with equipment suppliers (AMAT, LAM, ASM, TEL) on process optimization
- Fab startup experience across manufacturing, quality, R and D, and supply chain functions
- Experience with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems
Preferred Qualifications
- Ph.D. in Electrical/ Mechanical or Chemical Engineering, Materials Science, or in a STEM related field with research publications and patent portfolio in thin film technologies
- Experience in Gate All Around (GAA) logic technologies within semiconductor foundry environments
- Experience delivering customized solutions across Technology Development and HVM organizations
- Cross-functional leadership experience managing diverse stakeholder groups
- Semiconductor foundry experience
Why This Role Matters: This high-visibility position directly impacts Intel's foundry competitiveness and customer success. You will work on industry-defining technologies while building expertise that positions you as a leader in advanced semiconductor manufacturing.
Work Environment
This role emphasizes collaborative, in-person work to enable rapid innovation cycles and real-time problem resolution in Intel's state-of-the-art manufacturing facilities.
Ready to Shape the Future? Join Intel's mission to push the boundaries of semiconductor manufacturing technology. Your expertise will directly influence the next generation of computing innovations and manufacturing excellence.
Apply today to become part of our world-class MDCE team and help define the future of semiconductor technology.
Job Type
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
US, Arizona, Phoenix
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .
Annual Salary Range for jobs which could be performed in the US: $155,520. 00-298,440. 00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.