LandOffer
R&D Thermal Design Engineer — HP Workstations
Job details
- Pay
- $93,400 – $143,800 a year
- Work mode
- On-site
- Employment
- Full-time
- Education
- Bachelor's degree
- Posted
- Nov 11, 2026
- Last confirmed open
- Nov 13, 2026
What you'll need to apply
Fields this application requires
Company-specific questions
- 1. Within the past 5 years, have you been employed by the federal or any state or local government or public institution within Australia, Bangladesh, Brazil, Canada, China, Ireland, Korea, Mexico, Pakistan, Philippines, Puerto Rico, Taiwan, United Kingdom, United States and/or Vietnam?
- Conflict of Interest Question 1: HP Policy prohibits employees from engaging in activities that pose a conflict(s) of interest for HP such as: - Outside employment with or receiving compensation from a customer, business partner, supplier, or competitor - Significant financial interest in a customer, business partner, supplier, or competitor held by you or a family member - Conducting business with a customer, business partner, supplier, or channel partner when someone you have a close personal or family relationship has a substantial role in that company - Close personal relationships between employees in the same organization To identify situations that may pose a conflict and be inconsistent with this policy, please advise if you would be engaging in any of the above listed situations or activities during your HP employment if you were hired into the role for which you have applied.
- Conflict of Interest Question 2: Certain Legal and ethical restrictions may apply with respect to relationships with government officials. In order to avoid even the appearance of a conflict of interest, please advise: Whether you have served or are serving in a government or public body that has regulatory authority over HP or that purchases from HP.
- Conflict of Interest Question 3: Certain Legal and ethical restrictions may apply with respect to relationships with government officials. In order to avoid even the appearance of a conflict of interest, please advise: Whether a family member or anyone with whom you have a close personal relationship is a government official with regulatory authority over HP or authority to make or influence a decision to obtain or retain HP business.
- Non-compete Question: Have you signed or accepted any agreement with a current or prior employer that includes restrictions on competition or solicitation, including, but not limited to, non-competition agreement, non-disclosure agreement, non-solicitation agreement, or are you otherwise subject to restrictions that may affect your ability to fulfill responsibilities of this HP role?
- In order to comply with the U.S. Export Control regulations, HP must conduct specific, pre-interview screenings of candidates globally. In order to conduct these screenings, we must obtain information about citizenship/permanent residency. This Information will be used for the sole purpose of US Export Control screenings and will not be considered in any way during the candidate selection process. Please indicate if you are a citizen or permanent resident of ONE OR MORE of the countries listed below, by answering 'yes'. If you are not a citizen/permanent resident of one of the countries listed below, please answer 'no'. The countries are: The countries are: Armenia, Azerbaijan, Belarus, Cambodia, China (People's Republic of China), Cuba, Georgia, Hong Kong, Iran, Iraq, Kazakhstan, Kyrgyzstan, Laos, Libya, Macao (Macau), Moldova, Mongolia, Myanmar (Burma), Nicaragua, North Korea (Democratic People’s Republic of Korea), North Sudan (Khartoum), Russia, Syria, Tajikistan, Turkmenistan, Ukraine, Uzbekistan, Venezuela, Vietnam, Yemen.
- To help us understand your preferences related to personal data and uses for future recruitment processes, are you an existing HP employee?
About this role
R&D Thermal
Design Engineer — HP Workstations
Description -
About Us: HP Advanced Compute and Solutions (ACS) builds mission-critical workstations for professionals across a range of fields, including architecture, engineering, product design, financial services, medical equipment, defense, and AI development.
ACS R&D Thermal
Design Engineer. Join the HP Workstation engineering team to develop thermal and acoustic solutions for high-performance systems. You will influence system architecture, fan-control strategy, acoustics, and reliability as new technologies move from concept to market.
In this role, you will own thermal and acoustic development from early architecture through validation and product readiness, turning analysis and test results into practical system decisions.
Key Responsibilities
- Design Excellence: Develop and integrate thermal and acoustic solutions that balance compute performance, acoustics, reliability, cost, and schedule.
- Thermal Expertise: Evaluate emerging thermal-management and fan-control technologies and translate promising approaches into system-level designs.
- Performance Optimization: Develop and execute validation plans, analyze results, and use the findings to improve thermal, fan-control, acoustic, and reliability performance.
- Expert Collaboration: Work with internal teams and external development partners to communicate evidence, resolve trade-offs, and align on design decisions and system requirements.
- Strategic Planning: Influence thermal architecture roadmaps and deliver solutions within project scope and budget requirements.
Education and Experience
- Education: Bachelor’s or master’s degree in mechanical engineering or a closely related engineering discipline.
- Experience: At least three years of relevant experience in computer-system thermal design, validation, fan control, and acoustics optimization.
Skills and Knowledge
- Ability to use Computational Fluid Dynamics (CFD) and thermal mockups to predict system behavior, correlate models with test data, and refine designs.
- Proficiency with 3D CAD tools, such as ProEngineer, for mechanical design and design communication.
- Strong analytical and problem-solving skills, including root-cause analysis and evaluation of technical trade-offs.
- Strong written and verbal communication skills in English, including the ability to present proposals, explain trade-offs, and build alignment across technical teams and partner organizations.
Why Join Us? Solve complex thermal and acoustic challenges that affect professionals who depend on HP workstations for demanding, mission-critical work. You will have broad technical scope and influence products from early architecture through validation.
Make Your Mark
If you make sound, evidence-based decisions and enjoy solving complex system challenges, we invite you to help shape the next generation of HP high-performance workstations.
Apply to join HP Advanced Compute and Solutions.
The pay range for this role is $93,400 to $143,800 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.
Benefits
HP offers a comprehensive benefits package for this position, including:
- Health insurance
- Dental insurance
- Vision insurance
- Long term/short term disability insurance
- Employee assistance program
- Flexible spending account
- Life insurance
- Generous time off policies, including;
- 4-12 weeks fully paid parental leave based on tenure
- 11 paid holidays
- Additional flexible paid vacation and sick leave ( US benefits overview )
The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.
Job -
Engineering
Schedule -
Full time
Shift -
No shift premium (United States of America)
Travel -
Not Specified
Relocation -
Yes Equal Opportunity Employer (EEO) -
HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).
Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.
For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “ Know Your Rights: Workplace Discrimination is Illegal "