LandOffer
TW_感測器研發_Packaging Development Engineer
Spotted 47d agoMid-Senior LevelFull-time
Job details
- Employment
- Full-time
- Experience
- 3+ years
- Posted
- Jan 26, 2026
- Last confirmed open
- Oct 28, 2026
What you'll need to apply
What this employer's standard application typically asks
NameEmailPhoneResume
Job description
About this role
- Packaging Development Engineer for MEMS products
- Package design and process development in co-operation with supplier and product engineering team for electronic sensors.
- Develop and optimize assembly processes for MEMS in automotive and consumer-electronics acoustic applications.
- Oversee sample manufacturing and process qualification at assembly partners.
- Team work in English language with a multitude of international interfaces is mandatory.
- 3-8 Years experience in packaging/assembly of semiconductors components, especially familiar with LGA, BGA, DFN, WLCSP, SiP, micro-phone
- Preferred solid technical background in assembly technology. Experience with acoustic device development is a plus.
- Passion for developing technical solutions in multidisciplinary international projects
- Experience in international corporation
- Excellent English skills (verbal and written); willingness to travel as required.
- Good teamwork with multitude of international interfaces
Interested in this role?Continue on Bosch's careers page.
Apply on Bosch