Physical Failure Analysis Engineer

In this role, you will deliver professional failure analysis and characterization solutions across a wide array of next-generation materials, silicon devices, and advanced products; and collaborate with multi-functional teams to launch the world's most premiere products.

At Apple, we work every single day to craft products that enrich people’s lives. Do you love working on challenges that no one has solved yet? Do you like changing the game?

We have an opportunity for a forward-thinking and especially motivated Sample Prep Failure Analysis Engineer! As a member of our dynamic group, you will have the rare and great opportunity to work on upcoming products that will delight and encourage millions of Apple’s customers every day!

In this role, you will partner directly with cross-functional teams to evaluate incoming failure analysis requests, define appropriate analytical strategies, and perform hands-on physical preparation for root-cause isolation.

You will be responsible for preparing silicon, packaged components, and multi-layer boards (MLBs) using advanced CNC mechanical polishers, chemical and dry etching, and precision cross-sectioning techniques. You will provide samples optimized for high-resolution imaging, micro-probing, and nano-probing, conveying analytical findings to engineering teams and upper management.

Your expert craftsmanship, creativity, and analytical rigor will be indispensable in guaranteeing our beloved Apple products are delivered to the world on time.

B.S. with 4+ years, A.A. with 6+ years, or High School Diploma with 8+ years of relevant hands-on FA sample prep experience.

Deep understanding of fundamental failure analysis methodologies, defect isolation workflows, and sample preparation principles Extensive hands-on experience with mechanical cross-sectioning, encapsulation, and iterative planar polishing Extensive hands-on experience with CNC-based polishers, decapsulation, parallel lapping of MLBs, and packaged die Hands-on proficiency with wet and dry etch methods for sample de-processing and material removal Proficiency in optical microscopy and basic understanding of mechanical and microelectronic assemblies Strong 3D spatial awareness and ability to visualize and reconstruct internal device architectures in three dimensions Proven track record of independently troubleshooting preparation challenges, prioritizing tasks, and completing projects under tight deadlines Strong technical writing, reporting, and verbal communication skills in English Ability to work collaboratively and effectively across multidisciplinary engineering organizations Excellent communication skills

Hands-on experience with Focused Ion Beam (FIB) cross-sectioning and circuit edit techniques Proven experience preparing samples specifically tailored for nano-probing and micro-probing on sub-micron or advanced silicon nodes Hands-on experience with advanced broad-beam argon ion milling (BIB) for artifact-free cross-sectional and planar polishing Practical knowledge and operational familiarity with advanced imaging and analytical tools, including SEM (Scanning Electron Microscopy) and EDS (Energy Dispersive X-ray Spectroscopy) Prior experience supporting failure analysis for advanced packaging (multi-chip modules, SiP, 2.5D/3D architectures) or complex micro-electronic assemblies Working knowledge of analytical techniques such as FT-IR and GC, or specialized chemical de-processing workflows Demonstrated ability to establish standardized operating procedures (SOPs) and training modules for precision sample preparation