IC Package Design Engineer
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- Have you previously worked at Apple?
About this role
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Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for Apple’s internal and custom components across products including iPhone, iPad, Mac, Apple Watch, and Apple TV. We’re looking for a Package Design Engineer to drive the physical design and integration of advanced semiconductor packages across SoC, memory, RF, and cellular technologies.
You will play a key role in shaping the architecture, scalability, and efficiency of next-generation products while advancing design methodologies through automation and AI.
As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical design from concept through tape-out.
You will collaborate closely with cross-functional teams to deliver optimized SI/PI performance across a wide range of silicon technologies You are expected to leverage AI tools to enhance design efficiency, quality and performance.
BS and 10+ years of relevant industry experience
Package Design Proficiency: Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms, with knowledge of diverse package types (SiP, PoP, wirebond) and verification tools (Calibre, CAM350).
High-Speed & SI/PI Expertise
Strong understanding of high-speed interface layout constraints (DDR, PCIe) and Signal/Power Integrity (SI/PI) analysis, including experience with simulation tools like HFSS or PowerSI and parasitic extraction (RLGC, S-parameters).
Manufacturing & Materials Knowledge
Solid grasp of substrate manufacturing processes, design rules (DRC), design for manufacturability (DFM), and various sophisticated package configurations and assembly technology Automation & Scripting Skills: Familiarity with a Unix/Linux environment and proficiency in scripting languages such as Python, Perl, or TCL to automate design tasks and improve workflows.